Faculty of Engineering - Ain Shams University, Home

VLSI Technology

Course Aims
The course aims to: • Build the student background in issues related to electronic technology. • Help students develop a thorough understanding of different integrated circuits fabrication processes, their environment, and their requirements.
Course Goals
Decent Work and Economic Growth
Industry, Innovation and Infrastructure
Responsible Consumption and Production

ECE222

English Description

IC Processing, Clean Rooms and Clean Room Technology, Bulk Crystal growth, Epitaxial growth, Photolithography, Etching, Oxidation process, Diffusion process, Chemical vapour deposition CVD, Evaporation and multilayer coating, Ionic exchange process, Fabrication of passive and active components, Process integration and standard technologies, Layout design rules, Layout parasitics, Layout techniques, Interconnect modeling.
Arabic Description

IC Processing, Clean Rooms and Clean Room Technology, Bulk Crystal growth, Epitaxial growth, Photolithography, Etching, Oxidation process, Diffusion process, Chemical vapour deposition CVD, Evaporation and multilayer coating, Ionic exchange process, Fabrication of passive and active components, Process integration and standard technologies, Layout design rules, Layout parasitics, Layout techniques, Interconnect modeling.

Department
Electronics and Communications Engineering
Credit Hours
3
Grades
Total ( 100 ) = Midterm (20) + tr.Major Assessment (35 = tr.Industry 0% , tr.Project 35% , tr.Self_learning 0% , tr.Seminar 5% ) + tr.Minor Assessment (5) + Exam Grade (40)
Hours
Lecture Hours: 3, Tutorial Hours: 1, Lab Hours: 0
Required SWL
125
Equivalent ECTS
5

• R. J. Baker, “CMOS: Circuit Design, Layout, and Simulation,” 4th Edition, IEEE Press Series on Microelectronic Systems, 2019.
• S. Campbell, “Fabrication Engineering at the Micro- and Nanoscale,” 4th Edition, Oxford University Press, 2013.
• A. Hastings, “The Art of Analog Layout,” 2nd Edition, Pearson, 2005.