What Will Learn?

• Course Aims

  By the end of the course the students will be able to: • Understand the physical and chemical principles of MEMS and NEMS devices and their behavior under different operating conditions. • Learn the design and simulation tools for MEMS and NEMS, such as finite element analysis, lumped element modeling, and computational fluid dynamics. • Develop an understanding of the principles of nanoscale materials and their properties. • Explain the basic design principles for MEMS/NEMS and Micro/Nano systems. • Demonstrate the basic principle of nanotechnology and nano-scale engineering. • Illustrate the basic principles of fabrication techniques used in micro/nano devices and micro/nano systems, as well as integrated circuits. • Appreciate the ethical, social, and environmental implications of MEMS and NEMS technology and its impact on society.

Requirements

MCT343

Description

• English Description
  
  Introduction to microfabrication and micromachining (surface vs bulk), Photolithography, Thermal oxidation, Dry and Wet etching, Deposition techniques, Sputtering and shadow masking, Thermal oxidation, Doping, Deep reactive ion etching, Surface smoothing, MEMS packaging overview, Wafer bonding and encapsulation, Dicing, 3D integration and via technologies, Die packaging and wire bonding, On-wafer measurement
• Arabic Description
  
  Introduction to microfabrication and micromachining (surface vs bulk), Photolithography, Thermal oxidation, Dry and Wet etching, Deposition techniques, Sputtering and shadow masking, Thermal oxidation, Doping, Deep reactive ion etching, Surface smoothing, MEMS packaging overview, Wafer bonding and encapsulation, Dicing, 3D integration and via technologies, Die packaging and wire bonding, On-wafer measurement